联系电话: 0594-2207601

Silicon

Silicon Warfer(CZ)

Silicon Warfer(CZ)



Standard thickness silicon wafer specification(CZ)



Diameter1“2”3“4“5”6“8”12“
Growth methodCZ
Purity11N
Diameter(mm)25.4±0.150.8±0.276.2±0.2100±0.2125±0.2150±0.2200±0.2300±0.2
Thickness(um)500±15280±25380±25525±25625±25675±25725±25775±25
PolishingSingle toss/Double tossSingle toss/Double tossSingle toss/Double tossSingle toss/Double tossSingle toss/Double tossSingle toss/Double tossSingle tossDouble toss
RoughnessRa<5ARa<5ARa<5ARa<5ARa<5ARa<5ARa<5ARa<5A
TypeP/B, N/Ph, N/As, N/SbP/B

Crystal 

orientation

<100><111><110>±0.5<100><111>±0.5<100>±0.5

Electrical 

resistivity

0.01-100ohm-cm(P/B, N/Ph);0.01-0.05ohm-cm(N/Sb);0.001-0.005ohm-cm(N/As)1-100ohm-cm

Principal 

reference 

edge

NO16.0±2.022.5±2.532.5±2.542.5±2.557.5±2.5NotchNotch

Secondary 

reference 

edge

NO8.0±2.011.5±1.518.0±2.027.5±2.537.5±2.5NONO
  TTV<5um<8um<10um<10um<10um<10um<10um<15um
Bow/Warp<5um<5um<15um<20um<20um<20um<20um<20um



上一篇: Silicon Warfer(FZ)

下一篇: 没有了!

您有任何问题都可以向我们咨询!