| 生长方式/Growth | CZ, FZ |
| 等级/Grade | Preme, test, Dummy, |
| 直径/Diameter | 1-12 inch/25.4-300mm |
| 厚度/Thickness | 50~775um |
| 表面处理/Finish | As cut, lapped, etched, SSP, DSP, etc |
| 晶向/Orientation | (100)(111)(110) |
| 晶向偏角/Off cut | up to 4 deg |
| 掺杂类型/Type/Dopant | P/B, N/Phos, N/As, N/Sb, Intrinsic |
| 电阻率/Resistivity | CZ:From 0.001 to 100 ohm-cm FZ:>3000 ohm-cm |
| 薄膜/Thin films | *PVD:AI,Cu,Au,Cr,Si,Ni,Fe,Mo.etc,Coating thicknesses up to 20,000Å/±5 *LPCVD/PECVD:OxIDE,Nitride,SiC,etc,Coating thicknesses up to 20,000Å/±3%% *Silicon epitaxial wafers and epitaxial services(SOS,GaN,GOI etc) |
| 加工服务/Processes | 定制双抛，超薄，超平硅片/DSP，ultra thin,ultra flat,etc 掏圆、减薄、切割/Downsizing,back grinding,dicing,etc. 微纳加工/MEMS |
其他可定制硅片：异形硅片、方形硅片、超薄硅片、光学级硅片
异形硅片：
方形硅片：
超厚硅片：
超薄硅片：
光学级硅片：
